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Samsung unveils new LPDDR5 multichip package for 5G smartphones

Samsung Electronics on Tuesday announced its new multi-chip package technology for 5G compatible smartphones. The company said that the uMCP equiped devices will be launched in the global market this month. Samsung is the world’s largest memory chip maker. The company has made a new memory chipset, whose mass production has also begun. It will be known as Low Power Double Data Rate 5 (LPDDR5) Universal Flash Storage (UFS). It will offer high-performance DRAM and NAND flash memory chipsets in a single compact package. The new MCP technology will provide a powerful speed of 25 Gbps, which will be 1.5 times faster than the previous generation LPDDRX.

Read more: Business Wire | Samsung Global Newsroom | DT Next

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